Transistor Gate Structures and Methods of Forming the Same

ABSTRACT

In an embodiment, a device includes: a p-type transistor including: a first channel region; a first gate dielectric layer on the first channel region; a tungsten-containing work function tuning layer on the first gate dielectric layer; and a first fill layer on the tungsten-containing work function tuning layer; and an n-type transistor including: a second channel region; a second gate dielectric layer on the second channel region; a tungsten-free work function tuning layer on the second gate dielectric layer; and a second fill layer on the tungsten-free work function tuning layer.

PRIORITY CLAIM AND CROSS-REFERENCE

This application claims the benefit of U.S. Provisional Application No.63/142,549, filed on Jan. 28, 2021, which application is herebyincorporated herein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as, for example, personal computers, cell phones, digital cameras,and other electronic equipment. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductor layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. However, asthe minimum features sizes are reduced, additional problems arise thatshould be addressed.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIG. 1 illustrates an example of a nanostructure field-effect transistor(nano-FET) in a three-dimensional view, in accordance with someembodiments.

FIGS. 2-20B are views of intermediate stages in the manufacturing ofnano-FETs, in accordance with some embodiments.

FIGS. 21A-21B are views of nano-FETs, in accordance with someembodiments.

FIGS. 22A-22B are views of nano-FETs, in accordance with someembodiments.

FIGS. 23A-23B are views of nano-FETs, in accordance with someembodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

According to various embodiments, gate structures for p-type devicesinclude work function tuning layers that are formed of atungsten-containing work function material (WFM). For example, thetungsten-containing WFM may be pure tungsten (e.g., fluorine-freetungsten), tungsten nitride, tungsten carbide, tungsten carbonitride, orthe like, which may be deposited by one of several deposition processes.Tungsten is suitable for tuning the work function of p-type devices.Advantageously, p-type devices with work function tuning layers formedof a tungsten-containing WFM may have a lower resistance than p-typedevices with work function tuning layers formed of a WFM that containsother metals (such as tantalum). Device performance may thus beimproved.

Embodiments are described in a particular context, a die includingnano-FETs. Various embodiments may be applied, however, to diesincluding other types of transistors (e.g., fin field effect transistors(FinFETs), planar transistors, or the like) in lieu of or in combinationwith the nano-FETs.

FIG. 1 illustrates an example of nano-FETs (e.g., nanowire FETs,nanosheet FETs, or the like), in accordance with some embodiments. FIG.1 is a three-dimensional view, where some features of the nano-FETs areomitted for illustration clarity. The nano-FETs may be nanosheetfield-effect transistors (NSFETs), nanowire field-effect transistors(NWFETs), gate-all-around field-effect transistors (GAAFETs), or thelike.

The nano-FETs include nanostructures 66 (e.g., nanosheets, nanowires, orthe like) over fins 62 on a substrate 50 (e.g., a semiconductorsubstrate), with the nanostructures 66 acting as channel regions for thenano-FETs. The nanostructures 66 may include p-type nanostructures,n-type nanostructures, or a combination thereof. Isolation regions 70,such as shallow trench isolation (STI) regions, are disposed betweenadjacent fins 62, which may protrude above and from between adjacentisolation regions 70. Although the isolation regions 70 aredescribed/illustrated as being separate from the substrate 50, as usedherein, the term “substrate” may refer to the semiconductor substratealone or a combination of the semiconductor substrate and the isolationregions. Additionally, although a bottom portion of the fins 62 areillustrated as being single, continuous materials with the substrate 50,the bottom portion of the fins 62 and/or the substrate 50 may include asingle material or a plurality of materials. In this context, the fins62 refer to the portion extending above and from between the adjacentisolation regions 70.

Gate dielectrics 122 are over top surfaces of the fins 62 and along topsurfaces, sidewalls, and bottom surfaces of the nanostructures 66. Gateelectrodes 124 are over the gate dielectrics 122. Epitaxial source/drainregions 98 are disposed on the fins 62 at opposing sides of the gatedielectrics 122 and the gate electrodes 124. The epitaxial source/drainregions 98 may be shared between various fins 62. For example, adjacentepitaxial source/drain regions 98 may be electrically connected, such asthrough coalescing the epitaxial source/drain regions 98 by epitaxialgrowth, or through coupling the epitaxial source/drain regions 98 with asame source/drain contact.

FIG. 1 further illustrates reference cross-sections that are used inlater figures. Cross-section A-A′ is along a longitudinal axis of a gateelectrode 124 and in a direction, for example, perpendicular to adirection of current flow between the epitaxial source/drain regions 98of a nano-FET. Cross-section B-B′ is along a longitudinal axis of a fin62 and in a direction of, for example, a current flow between theepitaxial source/drain regions 98 of the nano-FET. Cross-section C-C′ isparallel to cross-section A-A′ and extends through epitaxialsource/drain regions 98 of the nano-FETs. Subsequent figures refer tothese reference cross-sections for clarity.

Some embodiments discussed herein are discussed in the context ofnano-FETs formed using a gate-last process. In other embodiments, agate-first process may be used. Also, some embodiments contemplateaspects used in planar devices, such as planar FETs, or in finfield-effect transistors (FinFETs). For example, FinFETs may includefins on a substrate, with the fins acting as channel regions for theFinFETs. Similarly, planar FETs may include a substrate, with portionsof the substrate acting as channel regions for the planar FETs.

FIGS. 2-20B are views of intermediate stages in the manufacturing ofnano-FETs, in accordance with some embodiments. FIGS. 2, 3, 4, 5, and 6are three-dimensional views showing a similar three-dimensional view asFIG. 1. FIGS. 7A, 8A, 9A, 10A, 11A, 12A, 13A, 14A, 15A, 16A, 17A, 18A,19A, and 20A illustrate reference cross-section A-A′ illustrated inFIG. 1. FIGS. 7B, 8B, 9B, 10B, 11B, 12B, 13B, 14B, 15B, 16B, 17B, 18B,19B, and 20B illustrate reference cross-section B-B′ illustrated inFIG. 1. FIGS. 9C and 9D illustrate reference cross-section C-C′illustrated in FIG. 1.

In FIG. 2, a substrate 50 is provided for forming nano-FETs. Thesubstrate 50 may be a semiconductor substrate, such as a bulksemiconductor, a semiconductor-on-insulator (SOI) substrate, or thelike, which may be doped (e.g., with a p-type or an n-type impurity) orundoped. The substrate 50 may be a wafer, such as a silicon wafer.Generally, a SOI substrate is a layer of a semiconductor material formedon an insulator layer. The insulator layer may be, for example, a buriedoxide (BOX) layer, a silicon oxide layer, or the like. The insulatorlayer is provided on a substrate, typically a silicon or glasssubstrate. Other substrates, such as a multi-layered or gradientsubstrate may also be used. In some embodiments, the semiconductormaterial of the substrate 50 may include silicon; germanium; a compoundsemiconductor including silicon carbide, gallium arsenide, galliumphosphide, indium phosphide, indium arsenide, and/or indium antimonide;an alloy semiconductor including silicon germanium, gallium arsenidephosphide, aluminum indium arsenide, aluminum gallium arsenide, galliumindium arsenide, gallium indium phosphide, and/or gallium indiumarsenide phosphide; combinations thereof; or the like.

The substrate 50 has an n-type region 50N and a p-type region 50P. Then-type region 50N can be for forming n-type devices, such as NMOStransistors, e.g., n-type nano-FETs, and the p-type region 50P can befor forming p-type devices, such as PMOS transistors, e.g., p-typenano-FETs. The n-type region 50N may be physically separated from thep-type region 50P (not separately illustrated), and any number of devicefeatures (e.g., other active devices, doped regions, isolationstructures, etc.) may be disposed between the n-type region 50N and thep-type region 50P. Although one n-type region 50N and one p-type region50P are illustrated, any number of n-type regions 50N and p-type regions50P may be provided.

The substrate 50 may be lightly doped with a p-type or an n-typeimpurity. An anti-punch-through (APT) implantation may be performed onan upper portion of the substrate 50 to form an APT region. During theAPT implantation, impurities may be implanted in the substrate 50. Theimpurities may have a conductivity type opposite from a conductivitytype of source/drain regions that will be subsequently formed in each ofthe n-type region 50N and the p-type region 50P. The APT region mayextend under the source/drain regions in the nano-FETs. The APT regionmay be used to reduce the leakage from the source/drain regions to thesubstrate 50. In some embodiments, the doping concentration in the APTregion may be in the range of about 10¹⁸ cm⁻³ to about 10¹⁹ cm⁻³.

A multi-layer stack 52 is formed over the substrate 50. The multi-layerstack 52 includes alternating first semiconductor layers 54 and secondsemiconductor layers 56. The first semiconductor layers 54 are formed ofa first semiconductor material, and the second semiconductor layers 56are formed of a second semiconductor material. The semiconductormaterials may each be selected from the candidate semiconductormaterials of the substrate 50. In the illustrated embodiment, themulti-layer stack 52 includes three layers of each of the firstsemiconductor layers 54 and the second semiconductor layers 56. Itshould be appreciated that the multi-layer stack 52 may include anynumber of the first semiconductor layers 54 and the second semiconductorlayers 56.

In the illustrated embodiment, and as will be subsequently described ingreater detail, the first semiconductor layers 54 will be removed andthe second semiconductor layers 56 will patterned to form channelregions for the nano-FETs in both the n-type region 50N and the p-typeregion 50P. The first semiconductor layers 54 are sacrificial layers (ordummy layers), which will be removed in subsequent processing to exposethe top surfaces and the bottom surfaces of the second semiconductorlayers 56. The first semiconductor material of the first semiconductorlayers 54 is a material that has a high etching selectivity from theetching of the second semiconductor layers 56, such as silicongermanium. The second semiconductor material of the second semiconductorlayers 56 is a material suitable for both n-type and p-type devices,such as silicon.

In another embodiment (not separately illustrated), the firstsemiconductor layers 54 will be patterned to form channel regions fornano-FETs in one region (e.g., the p-type region 50P), and the secondsemiconductor layers 56 will be patterned to form channel regions fornano-FETs in another region (e.g., the n-type region 50N). The firstsemiconductor material of the first semiconductor layers 54 may be amaterial suitable for p-type devices, such as silicon germanium (e.g.,Si_(x)Ge_(1-x), where x can be in the range of 0 to 1), pure germanium,a III-V compound semiconductor, a II-VI compound semiconductor, or thelike. The second semiconductor material of the second semiconductorlayers 56 may be a material suitable for n-type devices, such assilicon, silicon carbide, a III-V compound semiconductor, a II-VIcompound semiconductor, or the like. The first semiconductor materialand the second semiconductor material may have a high etchingselectivity from the etching of one another, so that the firstsemiconductor layers 54 may be removed without removing the secondsemiconductor layers 56 in the n-type region 50N, and the secondsemiconductor layers 56 may be removed without removing the firstsemiconductor layers 54 in the p-type region 50P.

Each of the layers of the multi-layer stack 52 may be grown by a processsuch as vapor phase epitaxy (VPE) or molecular beam epitaxy (MBE),deposited by a process such as chemical vapor deposition (CVD) or atomiclayer deposition (ALD), or the like. Each of the layers may have a smallthickness, such as a thickness in a range of about 5 nm to about 30 nm.In some embodiments, some layers (e.g., the second semiconductor layers56) are formed to be thinner than other layers (e.g., the firstsemiconductor layers 54). For example, in embodiments in which the firstsemiconductor layers 54 are sacrificial layers (or dummy layers) and thesecond semiconductor layers 56 are patterned to form channel regions forthe nano-FETs in both the n-type region 50N and the p-type region 50P,the first semiconductor layers 54 can have a first thickness and thesecond semiconductor layers 56 can have a second thickness, with thesecond thickness being from about 30% to about 60% less than the firstthickness. Forming the second semiconductor layers 56 to a smallerthickness allows the channel regions to be formed at a greater density.

In FIG. 3, trenches are patterned in the substrate 50 and themulti-layer stack 52 to form fins 62, first nanostructures 64, andsecond nanostructures 66. The fins 62 are semiconductor strips patternedin the substrate 50. The first nanostructures 64 and the secondnanostructures 66 include the remaining portions of the firstsemiconductor layers 54 and the second semiconductor layers 56,respectively. The trenches may be patterned by any acceptable etchprocess, such as a reactive ion etch (RIE), neutral beam etch (NBE), thelike, or a combination thereof. The etching may be anisotropic.

The fins 62 and the nanostructures 64, 66 may be patterned by anysuitable method. For example, the fins 62 and the nanostructures 64, 66may be patterned using one or more photolithography processes, includingdouble-patterning or multi-patterning processes. Generally,double-patterning or multi-patterning processes combine photolithographyand self-aligned processes, allowing patterns to be created that have,for example, pitches smaller than what is otherwise obtainable using asingle, direct photolithography process. For example, in one embodiment,a sacrificial layer is formed over a substrate and patterned using aphotolithography process. Spacers are formed alongside the patternedsacrificial layer using a self-aligned process. The sacrificial layer isthen removed, and the remaining spacers may then be used as masks topattern the fins 62 and the nanostructures 64, 66. In some embodiments,the mask (or other layer) may remain on the nanostructures 64, 66.

The fins 62 and the nanostructures 64, 66 may each have widths in arange of about 8 nm to about 40 nm. In the illustrated embodiment, thefins 62 and the nanostructures 64, 66 have substantially equal widths inthe n-type region 50N and the p-type region 50P. In another embodiment,the fins 62 and the nanostructures 64, 66 in one region (e.g., then-type region 50N) are wider or narrower than the fins 62 and thenanostructures 64, 66 in another region (e.g., the p-type region 50P).

In FIG. 4, STI regions 70 are formed over the substrate 50 and betweenadjacent fins 62. The STI regions 70 are disposed around at least aportion of the fins 62 such that at least a portion of thenanostructures 64, 66 protrude from between adjacent STI regions 70. Inthe illustrated embodiment, the top surfaces of the STI regions 70 arecoplanar (within process variations) with the top surfaces of the fins62. In some embodiments, the top surfaces of the STI regions 70 areabove or below the top surfaces of the fins 62. The STI regions 70separate the features of adjacent devices.

The STI regions 70 may be formed by any suitable method. For example, aninsulation material can be formed over the substrate 50 and thenanostructures 64, 66, and between adjacent fins 62. The insulationmaterial may be an oxide, such as silicon oxide, a nitride, such assilicon nitride, the like, or a combination thereof, which may be formedby a chemical vapor deposition (CVD) process, such as high densityplasma CVD (HDP-CVD), flowable chemical vapor deposition (FCVD), thelike, or a combination thereof. Other insulation materials formed by anyacceptable process may be used. In some embodiments, the insulationmaterial is silicon oxide formed by FCVD. An anneal process may beperformed once the insulation material is formed. In an embodiment, theinsulation material is formed such that excess insulation materialcovers the nanostructures 64, 66. Although the STI regions 70 are eachillustrated as a single layer, some embodiments may utilize multiplelayers. For example, in some embodiments a liner (not separatelyillustrated) may first be formed along surfaces of the substrate 50, thefins 62, and the nanostructures 64, 66. Thereafter, a fill material,such as those previously described may be formed over the liner.

A removal process is then applied to the insulation material to removeexcess insulation material over the nanostructures 64, 66. In someembodiments, a planarization process such as a chemical mechanicalpolish (CMP), an etch-back process, combinations thereof, or the likemay be utilized. In embodiments in which a mask remains on thenanostructures 64, 66, the planarization process may expose the mask orremove the mask. After the planarization process, the top surfaces ofthe insulation material and the mask (if present) or the nanostructures64, 66 are coplanar (within process variations). Accordingly, the topsurfaces of the mask (if present) or the nanostructures 64, 66 areexposed through the insulation material. In the illustrated embodiment,no mask remains on the nanostructures 64, 66. The insulation material isthen recessed to form the STI regions 70. The insulation material isrecessed such that at least a portion of the nanostructures 64, 66protrude from between adjacent portions of the insulation material.Further, the top surfaces of the STI regions 70 may have a flat surfaceas illustrated, a convex surface, a concave surface (such as dishing),or a combination thereof. The top surfaces of the STI regions 70 may beformed flat, convex, and/or concave by an appropriate etch. Theinsulation material may be recessed using any acceptable etchingprocess, such as one that is selective to the material of the insulationmaterial (e.g., selectively etches the insulation material of the STIregions 70 at a faster rate than the materials of the fins 62 and thenanostructures 64, 66). For example, an oxide removal may be performedusing dilute hydrofluoric (dHF) acid.

The process previously described is just one example of how the fins 62and the nanostructures 64, 66 may be formed. In some embodiments, thefins 62 and/or the nanostructures 64, 66 may be formed using a mask andan epitaxial growth process. For example, a dielectric layer can beformed over a top surface of the substrate 50, and trenches can beetched through the dielectric layer to expose the underlying substrate50. Epitaxial structures can be epitaxially grown in the trenches, andthe dielectric layer can be recessed such that the epitaxial structuresprotrude from the dielectric layer to form the fins 62 and/or thenanostructures 64, 66. The epitaxial structures may include thealternating semiconductor materials previously described, such as thefirst semiconductor material and the second semiconductor material. Insome embodiments where epitaxial structures are epitaxially grown, theepitaxially grown materials may be in situ doped during growth, whichmay obviate prior and/or subsequent implantations, although in situ andimplantation doping may be used together.

Further, appropriate wells (not separately illustrated) may be formed inthe nanostructures 64, 66, the fins 62, and/or the substrate 50. Thewells may have a conductivity type opposite from a conductivity type ofsource/drain regions that will be subsequently formed in each of then-type region 50N and the p-type region 50P. In some embodiments, ap-type well is formed in the n-type region 50N, and an n-type well isformed in the p-type region 50P. In some embodiments, a p-type well oran n-type well is formed in both the n-type region 50N and the p-typeregion 50P.

In embodiments with different well types, different implant steps forthe n-type region 50N and the p-type region 50P may be achieved usingmask (not separately illustrated) such as a photoresist. For example, aphotoresist may be formed over the fins 62, the nanostructures 64, 66,and the STI regions 70 in the n-type region 50N. The photoresist ispatterned to expose the p-type region 50P. The photoresist can be formedby using a spin-on technique and can be patterned using acceptablephotolithography techniques. Once the photoresist is patterned, ann-type impurity implant is performed in the p-type region 50P, and thephotoresist may act as a mask to substantially prevent n-type impuritiesfrom being implanted into the n-type region 50N. The n-type impuritiesmay be phosphorus, arsenic, antimony, or the like implanted in theregion to a concentration in the range of about 10¹³ cm⁻³ to about 10¹⁴cm⁻³. After the implant, the photoresist may be removed, such as by anyacceptable ashing process.

Following or prior to the implanting of the p-type region 50P, a mask(not separately illustrated) such as a photoresist is formed over thefins 62, the nanostructures 64, 66, and the STI regions 70 in the p-typeregion 50P. The photoresist is patterned to expose the n-type region50N. The photoresist can be formed by using a spin-on technique and canbe patterned using acceptable photolithography techniques. Once thephotoresist is patterned, a p-type impurity implant may be performed inthe n-type region 50N, and the photoresist may act as a mask tosubstantially prevent p-type impurities from being implanted into thep-type region 50P. The p-type impurities may be boron, boron fluoride,indium, or the like implanted in the region to a concentration in therange of about 10¹³ cm⁻³ to about 10¹⁴ cm⁻³. After the implant, thephotoresist may be removed, such as by any acceptable ashing process.

After the implants of the n-type region 50N and the p-type region 50P,an anneal may be performed to repair implant damage and to activate thep-type and/or n-type impurities that were implanted. In some embodimentswhere epitaxial structures are epitaxially grown for the fins 62 and/orthe nanostructures 64, 66, the grown materials may be in situ dopedduring growth, which may obviate the implantations, although in situ andimplantation doping may be used together.

In FIG. 5, a dummy dielectric layer 72 is formed on the fins 62 and thenanostructures 64, 66. The dummy dielectric layer 72 may be formed of adielectric material such as silicon oxide, silicon nitride, acombination thereof, or the like, which may be deposited or thermallygrown according to acceptable techniques. A dummy gate layer 74 isformed over the dummy dielectric layer 72, and a mask layer 76 is formedover the dummy gate layer 74. The dummy gate layer 74 may be depositedover the dummy dielectric layer 72 and then planarized, such as by aCMP. The mask layer 76 may be deposited over the dummy gate layer 74.The dummy gate layer 74 may be formed of a conductive or non-conductivematerial, such as amorphous silicon, polycrystalline-silicon(polysilicon), poly-crystalline silicon-germanium (poly-SiGe), a metal,a metallic nitride, a metallic silicide, a metallic oxide, or the like,which may be deposited by physical vapor deposition (PVD), CVD, or thelike. The dummy gate layer 74 may be formed of material(s) that have ahigh etching selectivity from the etching of insulation materials, e.g.,the STI regions 70 and/or the dummy dielectric layer 72. The mask layer76 may be formed of a dielectric material such as silicon nitride,silicon oxynitride, or the like. In this example, a single dummy gatelayer 74 and a single mask layer 76 are formed across the n-type region50N and the p-type region 50P. In the illustrated embodiment, the dummydielectric layer 72 covers the fins 62, the nanostructures 64, 66, andthe STI regions 70, such that the dummy dielectric layer 72 extends overthe STI regions 70 and between the dummy gate layer 74 and the STIregions 70. In another embodiment, the dummy dielectric layer 72 coversonly the fins 62 and the nanostructures 64, 66.

In FIG. 6, the mask layer 76 is patterned using acceptablephotolithography and etching techniques to form masks 86. The pattern ofthe masks 86 is then transferred to the dummy gate layer 74 by anyacceptable etching technique to form dummy gates 84. The pattern of themasks 86 may optionally be further transferred to the dummy dielectriclayer 72 by any acceptable etching technique to form dummy dielectrics82. The dummy gates 84 cover portions of the nanostructures 64, 66 thatwill be exposed in subsequent processing to form channel regions.Specifically, the dummy gates 84 extend along the portions of thenanostructures 66 that will be patterned to form channel regions 68. Thepattern of the masks 86 may be used to physically separate adjacentdummy gates 84. The dummy gates 84 may also have lengthwise directionssubstantially perpendicular (within process variations) to thelengthwise directions of the fins 62. The masks 86 can optionally beremoved after patterning, such as by any acceptable etching technique.

FIGS. 7A-20B illustrate various additional steps in the manufacturing ofembodiment devices. FIGS. 7A-13B and 18A-20B illustrate features ineither of the n-type region 50N and the p-type region 50P. For example,the structures illustrated may be applicable to both the n-type region50N and the p-type region 50P. Differences (if any) in the structures ofthe n-type region 50N and the p-type region 50P are described in thetext accompanying each figure. FIGS. 14A-16B illustrate features in thep-type region 50P. FIG. 17A-17B illustrates features in the n-typeregion 50N.

In FIGS. 7A and 7B, gate spacers 90 are formed over the nanostructures64, 66, on exposed sidewalls of the masks 86 (if present), the dummygates 84, and the dummy dielectrics 82. The gate spacers 90 may beformed by conformally depositing one or more dielectric material(s) andsubsequently etching the dielectric material(s). Acceptable dielectricmaterials may include silicon oxide, silicon nitride, siliconoxynitride, silicon oxycarbonitride, or the like, which may be formed bya conformal deposition process such as chemical vapor deposition (CVD),plasma-enhanced chemical vapor deposition (PECVD), atomic layerdeposition (ALD), plasma-enhanced atomic layer deposition (PEALD), orthe like. Other insulation materials formed by any acceptable processmay be used. In the illustrated embodiment, the gate spacers 90 eachinclude multiple layers, e.g., a first spacer layer 90A and a secondspacer layer 90B. In some embodiments, the first spacer layers 90A andthe second spacer layers 90B are formed of silicon oxycarbonitride(e.g., SiO_(x)N_(y)C_(1-x-y), where x and y are in the range of 0 to 1),with the first spacer layers 90A formed of a similar or a differentcomposition of silicon oxycarbonitride than the second spacer layers90B. Any acceptable etch process, such as a dry etch, a wet etch, thelike, or a combination thereof, may be performed to pattern thedielectric material(s). The etching may be anisotropic. The dielectricmaterial(s), when etched, have portions left on the sidewalls of thedummy gates 84 (thus forming the gate spacers 90). As will besubsequently described in greater detail, the dielectric material(s),when etched, may also have portions left on the sidewalls of the fins 62and/or the nanostructures 64, 66 (thus forming fin spacers 92, see FIGS.9C and 9D). After etching, the fin spacers 92 and/or the gate spacers 90can have straight sidewalls (as illustrated) or can have curvedsidewalls (not separately illustrated).

Further, implants may be performed to form lightly doped source/drain(LDD) regions (not separately illustrated). In the embodiments withdifferent device types, similar to the implants for the wells previouslydescribed, a mask (not separately illustrated) such as a photoresist maybe formed over the n-type region 50N, while exposing the p-type region50P, and appropriate type (e.g., p-type) impurities may be implantedinto the fins 62 and/or the nanostructures 64, 66 exposed in the p-typeregion 50P. The mask may then be removed. Subsequently, a mask (notseparately illustrated) such as a photoresist may be formed over thep-type region 50P while exposing the n-type region 50N, and appropriatetype impurities (e.g., n-type) may be implanted into the fins 62 and/orthe nanostructures 64, 66 exposed in the n-type region 50N. The mask maythen be removed. The n-type impurities may be any of the n-typeimpurities previously described, and the p-type impurities may be any ofthe p-type impurities previously described. During the implanting, thechannel regions 68 remain covered by the dummy gates 84, so that thechannel regions 68 remain substantially free of the impurity implantedto form the LDD regions. The LDD regions may have a concentration ofimpurities in the range of about 10¹⁵ cm⁻³ to about 10¹⁹ cm⁻³. An annealmay be used to repair implant damage and to activate the implantedimpurities.

It is noted that the previous disclosure generally describes a processof forming spacers and LDD regions. Other processes and sequences may beused. For example, fewer or additional spacers may be utilized,different sequence of steps may be utilized, additional spacers may beformed and removed, and/or the like. Furthermore, the n-type devices andthe p-type devices may be formed using different structures and steps.

In FIGS. 8A and 8B, source/drain recesses 94 are formed in thenanostructures 64, 66. In the illustrated embodiment, the source/drainrecesses 94 extend through the nanostructures 64, 66 and into the fins62. The source/drain recesses 94 may also extend into the substrate 50.In various embodiments, the source/drain recesses 94 may extend to a topsurface of the substrate 50 without etching the substrate 50; the fins62 may be etched such that bottom surfaces of the source/drain recesses94 are disposed below the top surfaces of the STI regions 70; or thelike. The source/drain recesses 94 may be formed by etching thenanostructures 64, 66 using an anisotropic etching processes, such as aRIE, a NBE, or the like. The gate spacers 90 and the dummy gates 84collectively mask portions of the fins 62 and/or the nanostructures 64,66 during the etching processes used to form the source/drain recesses94. A single etch process may be used to etch each of the nanostructures64, 66, or multiple etch processes may be used to etch thenanostructures 64, 66. Timed etch processes may be used to stop theetching of the source/drain recesses 94 after the source/drain recesses94 reach a desired depth.

Optionally, inner spacers 96 are formed on the sidewalls of theremaining portions of the first nanostructures 64, e.g., those sidewallsexposed by the source/drain recesses 94. As will be subsequentlydescribed in greater detail, source/drain regions will be subsequentlyformed in the source/drain recesses 94, and the first nanostructures 64will be subsequently replaced with corresponding gate structures. Theinner spacers 96 act as isolation features between the subsequentlyformed source/drain regions and the subsequently formed gate structures.Further, the inner spacers 96 may be used to substantially preventdamage to the subsequently formed source/drain regions by subsequentetching processes, such as etching processes used to subsequently removethe first nanostructures 64.

As an example to form the inner spacers 96, the source/drain recesses 94can be laterally expanded. Specifically, portions of the sidewalls ofthe first nanostructures 64 exposed by the source/drain recesses 94 maybe recessed. Although sidewalls of the first nanostructures 64 areillustrated as being straight, the sidewalls may be concave or convex.The sidewalls may be recessed by any acceptable etching process, such asone that is selective to the material of the first nanostructures 64(e.g., selectively etches the material of the first nanostructures 64 ata faster rate than the material of the second nanostructures 66). Theetching may be isotropic. For example, when the second nanostructures 66are formed of silicon and the first nanostructures 64 are formed ofsilicon germanium, the etching process may be a wet etch usingtetramethylammonium hydroxide (TMAH), ammonium hydroxide (NH₄OH), or thelike. In another embodiment, the etching process may be a dry etch usinga fluorine-based gas such as hydrogen fluoride (HF) gas. In someembodiments, the same etching process may be continually performed toboth form the source/drain recesses 94 and recess the sidewalls of thefirst nanostructures 64. The inner spacers 96 can then be formed byconformally forming an insulating material and subsequently etching theinsulating material. The insulating material may be silicon nitride orsilicon oxynitride, although any suitable material, such aslow-dielectric constant (low-k) materials having a k-value less thanabout 3.5, may be utilized. The insulating material may be deposited bya conformal deposition process, such as ALD, CVD, or the like. Theetching of the insulating material may be anisotropic. For example, theetching process may be a dry etch such as a RIE, a NBE, or the like.Although outer sidewalls of the inner spacers 96 are illustrated asbeing flush with respect to the sidewalls of the gate spacers 90, theouter sidewalls of the inner spacers 96 may extend beyond or be recessedfrom the sidewalls of the gate spacers 90. In other words, the innerspacers 96 may partially fill, completely fill, or overfill the sidewallrecesses. Moreover, although the sidewalls of the inner spacers 96 areillustrated as being straight, the sidewalls of the inner spacers 96 maybe concave or convex.

In FIGS. 9A and 9B, epitaxial source/drain regions 98 are formed in thesource/drain recesses 94. The epitaxial source/drain regions 98 areformed in the source/drain recesses 94 such that each dummy gate 84 (andcorresponding channel regions 68) is disposed between respectiveadjacent pairs of the epitaxial source/drain regions 98. In someembodiments, the gate spacers 90 and the inner spacers 96 are used toseparate the epitaxial source/drain regions 98 from, respectively, thedummy gates 84 and the first nanostructures 64 by an appropriate lateraldistance so that the epitaxial source/drain regions 98 do not short outwith subsequently formed gates of the resulting nano-FETs. A material ofthe epitaxial source/drain regions 98 may be selected to exert stress inthe respective channel regions 68, thereby improving performance.

The epitaxial source/drain regions 98 in the n-type region 50N may beformed by masking the p-type region 50P. Then, the epitaxialsource/drain regions 98 in the n-type region 50N are epitaxially grownin the source/drain recesses 94 in the n-type region 50N. The epitaxialsource/drain regions 98 may include any acceptable material appropriatefor n-type devices. For example, the epitaxial source/drain regions 98in the n-type region 50N may include materials exerting a tensile strainon the channel regions 68, such as silicon, silicon carbide, phosphorousdoped silicon carbide, silicon phosphide, or the like. The epitaxialsource/drain regions 98 in the n-type region 50N may be referred to as“n-type source/drain regions.” The epitaxial source/drain regions 98 inthe n-type region 50N may have surfaces raised from respective surfacesof the fins 62 and the nanostructures 64, 66, and may have facets.

The epitaxial source/drain regions 98 in the p-type region 50P may beformed by masking the n-type region 50N. Then, the epitaxialsource/drain regions 98 in the p-type region 50P are epitaxially grownin the source/drain recesses 94 in the p-type region 50P. The epitaxialsource/drain regions 98 may include any acceptable material appropriatefor p-type devices. For example, the epitaxial source/drain regions 98in the p-type region 50P may include materials exerting a compressivestrain on the channel regions 68, such as silicon germanium, boron dopedsilicon germanium, germanium, germanium tin, or the like. The epitaxialsource/drain regions 98 in the p-type region 50P may be referred to as“p-type source/drain regions.” The epitaxial source/drain regions 98 inthe p-type region 50P may have surfaces raised from respective surfacesof the fins 62 and the nanostructures 64, 66, and may have facets.

The epitaxial source/drain regions 98, the nanostructures 64, 66, and/orthe fins 62 may be implanted with impurities to form source/drainregions, similar to the process previously described for forming LDDregions, followed by an anneal. The source/drain regions may have animpurity concentration in the range of about 10¹⁹ cm⁻³ to about 10²¹cm⁻³. The n-type and/or p-type impurities for source/drain regions maybe any of the impurities previously described. In some embodiments, theepitaxial source/drain regions 98 may be in situ doped during growth.

As a result of the epitaxy processes used to form the epitaxialsource/drain regions 98, upper surfaces of the epitaxial source/drainregions have facets which expand laterally outward beyond sidewalls ofthe fins 62 and the nanostructures 64, 66. In some embodiments, thesefacets cause adjacent epitaxial source/drain regions 98 to merge asillustrated by FIG. 9C. In some embodiments, adjacent epitaxialsource/drain regions 98 remain separated after the epitaxy process iscompleted as illustrated by FIG. 9D. In the illustrated embodiments, thespacer etch used to form the gate spacers 90 is adjusted to also formfin spacers 92 on sidewalls of the fins 62 and/or the nanostructures 64,66. The fin spacers 92 are formed to cover a portion of the sidewalls ofthe fins 62 and/or the nanostructures 64, 66 that extend above the STIregions 70, thereby blocking the epitaxial growth. In anotherembodiment, the spacer etch used to form the gate spacers 90 is adjustedto not form fin spacers, so as to allow the epitaxial source/drainregions 98 to extend to the surface of the STI regions 70.

The epitaxial source/drain regions 98 may include one or moresemiconductor material layers. For example, the epitaxial source/drainregions 98 may each include a liner layer 98A, a main layer 98B, and afinishing layer 98C (or more generally, a first semiconductor materiallayer, a second semiconductor material layer, and a third semiconductormaterial layer). Any number of semiconductor material layers may be usedfor the epitaxial source/drain regions 98. Each of the liner layer 98A,the main layer 98B, and the finishing layer 98C may be formed ofdifferent semiconductor materials and may be doped to different impurityconcentrations. In some embodiments, the liner layer 98A may have alesser concentration of impurities than the main layer 98B, and thefinishing layer 98C may have a greater concentration of impurities thanthe liner layer 98A and a lesser concentration of impurities than themain layer 98B. In embodiments in which the epitaxial source/drainregions 98 include three semiconductor material layers, the liner layers98A may be grown in the source/drain recesses 94, the main layers 98Bmay be grown on the liner layers 98A, and the finishing layers 98C maybe grown on the main layers 98B.

In FIGS. 10A-10B, a first inter-layer dielectric (ILD) 104 is depositedover the epitaxial source/drain regions 98, the gate spacers 90, themasks 86 (if present) or the dummy gates 84. The first ILD 104 may beformed of a dielectric material, which may be deposited by any suitablemethod, such as CVD, plasma-enhanced CVD (PECVD), FCVD, or the like.Acceptable dielectric materials may include phospho-silicate glass(PSG), boro-silicate glass (BSG), boron-doped phospho-silicate glass(BPSG), undoped silicate glass (USG), or the like. Other insulationmaterials formed by any acceptable process may be used.

In some embodiments, a contact etch stop layer (CESL) 102 is formedbetween the first ILD 104 and the epitaxial source/drain regions 98, thegate spacers 90, and the masks 86 (if present) or the dummy gates 84.The CESL 102 may be formed of a dielectric material, such as siliconnitride, silicon oxide, silicon oxynitride, or the like, having a highetching selectivity from the etching of the first ILD 104. The CESL 102may be formed by an any suitable method, such as CVD, ALD, or the like.

In FIGS. 11A-11B, a removal process is performed to level the topsurfaces of the first ILD 104 with the top surfaces of the masks 86 (ifpresent) or the dummy gates 84. In some embodiments, a planarizationprocess such as a chemical mechanical polish (CMP), an etch-backprocess, combinations thereof, or the like may be utilized. Theplanarization process may also remove the masks 86 on the dummy gates84, and portions of the gate spacers 90 along sidewalls of the masks 86.After the planarization process, the top surfaces of the gate spacers90, the first ILD 104, the CESL 102, and the masks 86 (if present) orthe dummy gates 84 are coplanar (within process variations).Accordingly, the top surfaces of the masks 86 (if present) or the dummygates 84 are exposed through the first ILD 104. In the illustratedembodiment, the masks 86 remain, and the planarization process levelsthe top surfaces of the first ILD 104 with the top surfaces of the masks86.

In FIGS. 12A-12B, the masks 86 (if present) and the dummy gates 84 areremoved in an etching process, so that recesses 106 are formed. Portionsof the dummy dielectrics 82 in the recesses 106 are also removed. Insome embodiments, the dummy gates 84 are removed by an anisotropic dryetch process. For example, the etching process may include a dry etchprocess using reaction gas(es) that selectively etch the dummy gates 84at a faster rate than the first ILD 104 or the gate spacers 90. Duringthe removal, the dummy dielectrics 82 may be used as etch stop layerswhen the dummy gates 84 are etched. The dummy dielectrics 82 are thenremoved. Each recess 106 exposes and/or overlies portions of the channelregions 68. Portions of the second nanostructures 66 which act as thechannel regions 68 are disposed between adjacent pairs of the epitaxialsource/drain regions 98.

The remaining portions of the first nanostructures 64 are then removedto expand the recesses 106, such that openings 108 are formed in regions501 between the second nanostructures 66. The remaining portions of thefirst nanostructures 64 can be removed by any acceptable etching processthat selectively etches the material of the first nanostructures 64 at afaster rate than the material of the second nanostructures 66. Theetching may be isotropic. For example, when the first nanostructures 64are formed of silicon germanium and the second nanostructures 66 areformed of silicon, the etching process may be a wet etch usingtetramethylammonium hydroxide (TMAH), ammonium hydroxide (NH₄OH), or thelike. In some embodiments, a trim process (not separately illustrated)is performed to decrease the thicknesses of the exposed portions of thesecond nanostructures 66. As illustrated more clearly in FIGS. 14A-16B(subsequently described in greater detail), the remaining portions ofthe second nanostructures 66 can have rounded corners.

In FIGS. 13A-13B, a gate dielectric layer 112 is formed in the recesses106. A gate electrode layer 114 is formed on the gate dielectric layer112. The gate dielectric layer 112 and the gate electrode layer 114 arelayers for replacement gates, and each wrap around all (e.g., four)sides of the second nanostructures 66.

The gate dielectric layer 112 is disposed on the sidewalls and/or thetop surfaces of the fins 62; on the top surfaces, the sidewalls, and thebottom surfaces of the second nanostructures 66; and on the sidewalls ofthe gate spacers 90. The gate dielectric layer 112 may also be formed onthe top surfaces of the first ILD 104 and the gate spacers 90. The gatedielectric layer 112 may include an oxide such as silicon oxide or ametal oxide, a silicate such as a metal silicate, combinations thereof,multi-layers thereof, or the like. The gate dielectric layer 112 mayinclude a dielectric material having a k-value greater than about 7.0,such as a metal oxide or a silicate of hafnium, aluminum, zirconium,lanthanum, manganese, barium, titanium, lead, and combinations thereof.Although a single-layered gate dielectric layer 112 is illustrated inFIGS. 13A-13B, as will be subsequently described in greater detail, thegate dielectric layer 112 may include any number of interfacial layersand any number of main layers.

The gate electrode layer 114 may include a metal-containing materialsuch as titanium nitride, titanium oxide, tungsten, cobalt, ruthenium,aluminum, combinations thereof, multi-layers thereof, or the like.Although a single-layered gate electrode layer 114 is illustrated inFIGS. 13A-13B, as will be subsequently described in greater detail, thegate electrode layer 114 may include any number of work function tuninglayers, any number of barrier layers, any number of glue layers, and afill material.

The formation of the gate dielectric layers 112 in the n-type region 50Nand the p-type region 50P may occur simultaneously such that the gatedielectric layers 112 in each region are formed of the same materials,and the formation of the gate electrode layers 114 may occursimultaneously such that the gate electrode layers 114 in each regionare formed of the same materials. In some embodiments, the gatedielectric layers 112 in each region may be formed by distinctprocesses, such that the gate dielectric layers 112 may be differentmaterials and/or have a different number of layers, and/or the gateelectrode layers 114 in each region may be formed by distinct processes,such that the gate electrode layers 114 may be different materialsand/or have a different number of layers. Various masking steps may beused to mask and expose appropriate regions when using distinctprocesses. In the following description, at least portions of the gateelectrode layers 114 in the n-type region 50N and the gate electrodelayers 114 in the p-type region 50P are formed separately.

FIGS. 14A-16B illustrate a process in which gate dielectric layers 112and gate electrode layers 114 for replacement gates are formed in therecesses 106 in the p-type region 50P. FIGS. 14A, 15A, and 16Aillustrate features in a region 50A in FIG. 13A. FIGS. 14B, 15B, and 16Billustrate features in a region 50B in FIG. 13B. The gate electrodelayers 114 in the p-type region 50P include work function tuninglayer(s) formed of a tungsten-containing material. Tungsten is suitablefor tuning the work function of the devices in the p-type region 50P.Advantageously, forming the work function tuning layer(s) of atungsten-containing material may allow the gate electrode layers 114 inthe p-type region 50P to have a lower resistance than gate electrodelayers with work function tuning layers formed of a material thatcontains other metals (such as tantalum). Device performance may thus beimproved. The n-type region 50N may be masked at least while formingportions of the gate electrode layers 114 in the p-type region 50P.

In FIGS. 14A-14B, the gate dielectric layer 112 is formed in therecesses 106. The gate dielectric layer 112 may also be deposited on thetop surfaces of the first ILD 104 and the gate spacers 90 (see FIG.13B). The formation methods of the gate dielectric layer 112 may includemolecular-beam deposition (MBD), ALD, PECVD, and the like. The gatedielectric layer 112 wraps around all (e.g., four) sides of the secondnanostructures 66. The gate dielectric layer 112 fills portions of theregions 501 between the second nanostructures 66 in the p-type region50P (e.g., portions of the openings 108 in the p-type region 50P). Inthe illustrated embodiment, the gate dielectric layer 112 ismulti-layered, including an interfacial layer 112A (or more generally, afirst gate dielectric sub-layer) and an overlying high-k dielectriclayer 112B (or more generally, a second gate dielectric sub-layer). Theinterfacial layer 112A may be formed of silicon oxide and the high-kdielectric layer 112B may be formed of hafnium oxide. The gatedielectric layer 112 may include any acceptable quantity and combinationof sub-layers.

In FIGS. 15A-15B, a first work function tuning layer 114A is optionallyformed on the gate dielectric layer 112, around the secondnanostructures 66 in the p-type region 50P. As will be subsequentlydescribed in greater detail, in some embodiments the first work functiontuning layer 114A is omitted. A second work function tuning layer 114Bis then formed on the first work function tuning layer 114A (if present)or the gate dielectric layer 112, around the second nanostructures 66 inthe p-type region 50P.

The first work function tuning layer 114A (if present) is formed of ap-type work function material (PWFM) that is acceptable to tune a workfunction of a device to a desired amount given the application of thedevice to be formed, and may be deposited using any acceptabledeposition process. Specifically, the first work function tuning layer114A is formed of a tungsten-free PWFM such as titanium nitride (TiN),tantalum nitride (TaN), combinations thereof, or the like, which may bedeposited by ALD, CVD, PVD, or the like. The first work function tuninglayer 114A may also be referred to as a “tungsten-free work functiontuning layer.” The first work function tuning layer 114A may be includedor omitted based on the desired work function of the result devices. Thefirst work function tuning layer 114A can have a thickness in the rangeof about 5 Å to about 60 Å. In the illustrated embodiment, the firstwork function tuning layer 114A is a single continuous layer of atungsten-free PWFM. In other embodiments, the first work function tuninglayer 114A is a multi-layer of tungsten-free PWFMs. The first workfunction tuning layer 114A fills portions of the regions 501 between thesecond nanostructures 66 in the p-type region 50P (e.g., portions of theopenings 108 in the p-type region 50P).

The second work function tuning layer 114B is formed of a p-type workfunction material (PWFM) that has a low resistivity, and may bedeposited using any acceptable deposition process. Specifically, thesecond work function tuning layer 114B is formed of atungsten-containing PWFM such as pure tungsten (e.g., fluorine-freetungsten), tungsten nitride, tungsten carbide, tungsten carbonitride, orthe like, which may be deposited by ALD, CVD, PVD, or the like. Thesecond work function tuning layer 114B may also be referred to as a“tungsten-containing work function tuning layer.” The second workfunction tuning layer 114B can have a thickness in the range of about 5Å to about 60 Å. In the illustrated embodiment, the second work functiontuning layer 114B is a single continuous layer of a tungsten-containingPWFM. In other embodiments (subsequently described for FIGS. 22A-23B),the second work function tuning layer 114B is a multi-layer oftungsten-containing PWFMs. The material of the second work functiontuning layer 114B may also be acceptable to tune a work function of adevice to a desired amount (in a similar manner as the first workfunction tuning layer 114A), but may have a lower resistivity than thematerial of the first work function tuning layer 114A. Deviceperformance may be improved by the use of PWFMs that have a lowresistivity.

In some embodiments, the second work function tuning layer 114B isformed of fluorine-free tungsten, which is deposited by an ALD process.Specifically, the second work function tuning layer 114B may be formedby placing the substrate 50 in a deposition chamber and cyclicallydispensing different source precursors into the deposition chamber. Thesource precursors include one or more tungsten source precursor(s) andone or more precursor(s) that react with the tungsten sourceprecursor(s) to form fluorine-free tungsten. Fluorine-free tungsten istungsten that is free of fluorine, and is deposited with a fluorine-freetungsten source precursor, e.g., a tungsten source precursor that isfree of fluorine. Depositing tungsten with a fluorine-free tungstensource precursor avoids the undesired production of corrosive fluoridebyproducts during deposition, which may increase manufacturing yield.

A first pulse of an ALD cycle is performed by dispensing a firstprecursor into the deposition chamber. The first precursor is afluorine-free tungsten source precursor. Acceptable fluorine-freetungsten source precursors include tungsten(V) chloride (WCl₅) or thelike. The first precursor can be kept in the deposition chamber for aduration in the range of about 0.2 seconds to about 5 seconds. The firstprecursor is then purged from the deposition chamber, such as by anyacceptable vacuuming process and/or by flowing an inert gas into thedeposition chamber.

A second pulse of the ALD cycle is performed by dispensing a secondprecursor into the deposition chamber. The second precursor is anyacceptable precursor that reacts with the first precursor (e.g., thefluorine-free tungsten source precursor) to deposit fluorine-freetungsten. For example, when the first precursor is tungsten(V) chloridethe second precursor may be hydrogen (H₂) or the like. The secondprecursor can be kept in the deposition chamber for a duration in therange of about 0.2 seconds to about 5 seconds. The second precursor isthen purged from the deposition chamber, such as by any acceptablevacuuming process and/or by flowing an inert gas into the depositionchamber.

Each ALD cycle results in the deposition of an atomic layer (sometimescalled a monolayer) of fluorine-free tungsten. For example, when thefirst precursor is tungsten(V) chloride and the second precursor ishydrogen, they may repeatedly react according to equations (1) and (2)to form gas-phase byproducts (which are purged from the depositionchamber) and fluorine-free tungsten.

WCl*_(X)+H₂→W−H*+HCl  (1)

W−H*+WCl₅→W−WCl*_(X)+HCl  (2)

The ALD cycles are repeated until fluorine-free tungsten is deposited toa desired thickness (previously described). For example, the ALD cyclescan be repeated from about 1 to about 500 times. Further, the ALDprocess can be performed at a temperature in the range of about 300° C.to about 500° C. and at a pressure in the range of about 0.5 torr toabout 50 torr, e.g., by maintaining the deposition chamber at such atemperature and pressure. Performing the ALD process with parameters inthese ranges allows the fluorine-free tungsten to be formed to a desiredthickness (previously described) and quality. Performing the ALD processwith parameters outside of these ranges may not allow the fluorine-freetungsten to be formed to the desired thickness or quality.

In some embodiments, the second work function tuning layer 114B isformed of tungsten nitride, which is deposited by ALD. The tungstennitride may be formed by a similar ALD process as that previouslydescribed for forming fluorine-free tungsten, except differentprecursors may be used. For example, the first precursor may be atungsten source precursor (which may or may not be fluorine-free), andthe second precursor may be a nitrogen source precursor that reacts withthe first precursor (e.g., the tungsten source precursor) to deposittungsten nitride. Acceptable tungsten source precursors for depositingtungsten nitride includebis(tert-butylimino)-bis-(dimethylamido)tungsten ((^(t)BuN)₂(Me₂N)₂W) orthe like. Acceptable nitrogen source precursors for depositing tungstennitride include ammonia (NH₃) or the like.

The ALD cycles are repeated until tungsten nitride is deposited to adesired thickness (previously described). For example, the ALD cyclescan be repeated from about 1 to about 500 times. Further, the ALDprocess can be performed at a temperature in the range of about 200° C.to about 450° C. and at a pressure in the range of about 0.1 torr toabout 60 torr, e.g., by maintaining the deposition chamber at such atemperature and pressure. Performing the ALD process with parameters inthese ranges allows the tungsten nitride to be formed to a desiredthickness (previously described) and quality. Performing the ALD processwith parameters outside of these ranges may not allow the tungstennitride to be formed to the desired thickness or quality.

The second work function tuning layer 114B fills the remaining portionsof the regions 501 between the second nanostructures 66 in the p-typeregion 50P (e.g., the remaining portions of the openings 108 in thep-type region 50P). Specifically, the second work function tuning layer114B is deposited on the first work function tuning layer 114A (ifpresent) or the gate dielectric layer 112 until it is thick enough tomerge and seam together. In embodiments where the first work functiontuning layer 114A is present, it can have a lesser thickness than thesecond work function tuning layer 114B, which may avoid merging of thefirst work function tuning layer 114A and promote merging of the secondwork function tuning layer 114B. Interfaces 118 may be formed by thecontacting of adjacent portions of the second work function tuning layer114B (e.g., those portions around the second nanostructures 66 in thep-type region 50P). The openings 108 in the p-type region 50P are thuscompletely filled by respective portions of the gate dielectric layer112, the first work function tuning layer 114A (if present), and thesecond work function tuning layer 114B. Specifically, respectiveportions of the gate dielectric layer 112 wrap around respective secondnanostructures 66 in the p-type region 50P, respective portions of thefirst work function tuning layer 114A wrap around the respectiveportions of the gate dielectric layer 112, and respective portions ofthe second work function tuning layer 114B wrap around the respectiveportions of the first work function tuning layer 114A, therebycompletely filling areas between the respective second nanostructures66. When the second work function tuning layer 114B is a singlecontinuous layer of a tungsten-free PWFM, the tungsten-free PWFM extendscontinuously between the respective portions of the first work functiontuning layer 114A (if present) or the respective portions of thedielectric layer 112. As noted above, the first work function tuninglayer 114A is a tungsten-free layer. No tungsten-containing layers aredisposed between the second work function tuning layer 114B and thesecond nanostructures 66 in the p-type region.

In FIGS. 16A-16B, a fill layer 114E is deposited on the second workfunction tuning layer 114B. Optionally, a glue layer 114D is formedbetween the fill layer 114E and the second work function tuning layer114B. After formation is complete, the gate electrode layers 114 in thep-type region 50P includes the first work function tuning layer 114A,the second work function tuning layer 114B, the glue layer 114D, and thefill layer 114E.

The glue layer 114D includes any acceptable material to promote adhesionand prevent diffusion. For example, the glue layer 114D may be formed ofa metal or metal nitride such as titanium nitride, titanium aluminide,titanium aluminum nitride, silicon-doped titanium nitride, tantalumnitride, or the like, which may be deposited by ALD, CVD, PVD, or thelike.

The fill layer 114E includes any acceptable material of a lowresistance. For example, the fill layer 114E may be formed of a metalsuch as tungsten, aluminum, cobalt, ruthenium, combinations thereof orthe like, which may be deposited by ALD, CVD, PVD, or the like. The filllayer 114E fills the remaining portions of the recesses 106.

FIG. 17A-17B illustrate gate dielectric layers 112 and gate electrodelayers 114 for replacement gates, which are formed in the recesses 106in the n-type region 50N. FIG. 17A illustrates features in a region 50Ain FIG. 13A. FIG. 17B illustrates features in a region 50B in FIG. 13B.In some embodiments, the gate dielectric layers 112 in the n-type region50N and the p-type region 50P may be formed simultaneously. Further, atleast portions of the gate electrode layers 114 in the n-type region 50Nmay be formed either before or after forming the gate electrode layers114 in the p-type region 50P, and at least portions of the gateelectrode layers 114 in the n-type region 50N may be formed while thep-type region 50P is masked. As such, the gate electrode layers 114 inthe n-type region 50N may include different materials than the gateelectrode layers 114 in the p-type region 50P. For example, the gateelectrode layers 114 in the n-type region 50N may include a third workfunction tuning layer 114C, a glue layer 114D, and a fill layer 114E. Aswill be subsequently described in greater detail, the third workfunction tuning layer 114C has a different material composition from thefirst work function tuning layer 114A and the second work functiontuning layer 114B. The glue layer 114D in the n-type region 50N may (ormay not) have a same material composition as (and be depositedconcurrently with) the glue layer 114D in the p-type region 50P. Thefill layer 114E in the n-type region 50N may (or may not) have a samematerial composition as (and be deposited concurrently with) the filllayer 114E in the p-type region 50P.

The third work function tuning layer 114C is formed of an n-type workfunction material (NWFM) that is acceptable to tune a work function of adevice to a desired amount given the application of the device to beformed, and may be deposited using any acceptable deposition process.Specifically, the third work function tuning layer 114C is formed of atungsten-free NWFM such as titanium aluminum, titanium aluminum carbide,tantalum aluminum, tantalum carbide, combinations thereof, or the like,which may be deposited by ALD, PEALD, PVD, CVD, PECVD, or the like. Thematerial of the third work function tuning layer 114C is different thanthe material of the first work function tuning layer 114A and thematerial of the second work function tuning layer 114B. In someembodiments, the first work function tuning layer 114A may be formed oftitanium nitride, the second work function tuning layer 114B may beformed of fluorine-free tungsten or tungsten nitride, and the third workfunction tuning layer 114C may be formed of titanium aluminum.

The material of the third work function tuning layer 114C may also havea low resistivity (in a similar manner as the second work functiontuning layer 114B). The material of the third work function tuning layer114C may have a lower resistivity than the material of the first workfunction tuning layer 114A. Device performance may be improved by theuse of NWFMs that have a low resistivity. The material of the third workfunction tuning layer 114C may have a higher resistivity or a lowerresistivity than the material of the second work function tuning layer114B. In some embodiments, the material of the third work functiontuning layer 114C has a lower resistivity than the material of the firstwork function tuning layer 114A and a higher resistivity than thematerial of the second work function tuning layer 114B.

The third work function tuning layer 114C fills the remaining portionsof the regions 501 between the second nanostructures 66 in the n-typeregion 50N (e.g., the remaining portions of the openings 108 in then-type region 50N). Specifically, the third work function tuning layer114C is deposited on the gate dielectric layer 112 until it is thickenough to merge and seam together. Interfaces 120 may be formed by thecontacting of adjacent portions of the third work function tuning layer114C (e.g., those portions around the second nanostructures 66 in then-type region 50N). Respective portions of the gate dielectric layer 112wrap around respective second nanostructures 66 in the n-type region50N, and respective portions of the third work function tuning layer114C wrap around the respective portions of the gate dielectric layer112, thereby completely filling areas between the respective secondnanostructures 66.

In FIGS. 18A-18B, a removal process is performed to remove the excessportions of the materials of the gate dielectric layer 112 and the gateelectrode layer 114, which excess portions are over the top surfaces ofthe first ILD 104 and the gate spacers 90, thereby forming gatedielectrics 122 and gate electrodes 124. In some embodiments, aplanarization process such as a chemical mechanical polish (CMP), anetch-back process, combinations thereof, or the like may be utilized.The gate dielectric layer 112, when planarized, has portions left in therecesses 106 (thus forming the gate dielectrics 122). The gate electrodelayer 114, when planarized, has portions left in the recesses 106 (thusforming the gate electrodes 124). The top surfaces of the gate spacers90; the CESL 102; the first ILD 104; the gate dielectrics 122 (e.g., theinterfacial layers 112A and the high-k dielectric layers 112B, see FIGS.14A-17B); and the gate electrodes 124 (e.g., the work function tuninglayers 114A, 114B, 114C, the glue layer 114D (if present), and the filllayer 114E, see FIGS. 14A-17B) are coplanar (within process variations).The gate dielectrics 122 and the gate electrodes 124 form replacementgates of the resulting nano-FETs. Each respective pair of a gatedielectric 122 and a gate electrode 124 may be collectively referred toas a “gate structure.” The gate structures each extend along topsurfaces, sidewalls, and bottom surfaces of a channel region 68 of thesecond nanostructures 66.

In FIGS. 19A-19B, a second ILD 134 is deposited over the gate spacers90, the CESL 102, the first ILD 104, the gate dielectrics 122, and thegate electrodes 124. In some embodiments, the second ILD 134 is aflowable film formed by a flowable CVD method. In some embodiments, thesecond ILD 134 is formed of a dielectric material such as PSG, BSG,BPSG, USG, or the like, which may be deposited by any suitable method,such as CVD, PECVD, or the like.

In some embodiments, an etch stop layer (ESL) 132 is formed between thesecond ILD 134 and the gate spacers 90, the CESL 102, the first ILD 104,the gate dielectrics 122, and the gate electrodes 124. The ESL 132 mayinclude a dielectric material, such as, silicon nitride, silicon oxide,silicon oxynitride, or the like, having a high etching selectivity fromthe etching of the second ILD 134.

In FIGS. 20A-20B, gate contacts 142 and source/drain contacts 144 areformed to contact, respectively, the gate electrodes 124 and theepitaxial source/drain regions 98. The gate contacts 142 are physicallyand electrically coupled to the gate electrodes 124. The source/draincontacts 144 are physically and electrically coupled to the epitaxialsource/drain regions 98.

As an example to form the gate contacts 142 and the source/draincontacts 144, openings for the gate contacts 142 are formed through thesecond ILD 134 and the ESL 132, and openings for the source/draincontacts 144 are formed through the second ILD 134, the ESL 132, thefirst ILD 104, and the CESL 102. The openings may be formed usingacceptable photolithography and etching techniques. A liner (notseparately illustrated), such as a diffusion barrier layer, an adhesionlayer, or the like, and a conductive material are formed in theopenings. The liner may include titanium, titanium nitride, tantalum,tantalum nitride, or the like. The conductive material may be copper, acopper alloy, silver, gold, tungsten, cobalt, aluminum, nickel, or thelike. A planarization process, such as a CMP, may be performed to removeexcess material from a surface of the second ILD 134. The remainingliner and conductive material form the gate contacts 142 and thesource/drain contacts 144 in the openings. The gate contacts 142 and thesource/drain contacts 144 may be formed in distinct processes, or may beformed in the same process. Although shown as being formed in the samecross-sections, it should be appreciated that each of the gate contacts142 and the source/drain contacts 144 may be formed in differentcross-sections, which may avoid shorting of the contacts.

Optionally, metal-semiconductor alloy regions 146 are formed at theinterfaces between the epitaxial source/drain regions 98 and thesource/drain contacts 144. The metal-semiconductor alloy regions 146 canbe silicide regions formed of a metal silicide (e.g., titanium silicide,cobalt silicide, nickel silicide, etc.), germanide regions formed of ametal germanide (e.g. titanium germanide, cobalt germanide, nickelgermanide, etc.), silicon-germanide regions formed of both a metalsilicide and a metal germanide, or the like. The metal-semiconductoralloy regions 146 can be formed before the material(s) of thesource/drain contacts 144 by depositing a metal in the openings for thesource/drain contacts 144 and then performing a thermal anneal process.The metal can be any metal capable of reacting with the semiconductormaterials (e.g., silicon, silicon-germanium, germanium, etc.) of theepitaxial source/drain regions 98 to form a low-resistancemetal-semiconductor alloy, such as nickel, cobalt, titanium, tantalum,platinum, tungsten, other noble metals, other refractory metals, rareearth metals or their alloys. The metal can be deposited by a depositionprocess such as ALD, CVD, PVD, or the like. After the thermal annealprocess, a cleaning process, such as a wet clean, may be performed toremove any residual metal from the openings for the source/draincontacts 144, such as from surfaces of the metal-semiconductor alloyregions 146. The material(s) of the source/drain contacts 144 can thenbe formed on the metal-semiconductor alloy regions 146.

FIGS. 21A-21B are views of nano-FETs, in accordance with some otherembodiments. This embodiment is similar to the embodiment described forFIGS. 16A-16B, except the first work function tuning layer 114A isomitted. Thus, the openings 108 in the p-type region 50P are completelyfilled by respective portions of the gate dielectric layer 112 and thesecond work function tuning layer 114B. In the illustrated embodiment,the second work function tuning layer 114B is a single continuous layerof a tungsten-containing PWFM such that the tungsten-containing PWFMextends continuously between the respective portions of the dielectriclayer 112.

FIGS. 22A-23B are views of nano-FETs, in accordance with some otherembodiments. These embodiments are similar to the embodiment describedfor FIGS. 21A-21B, except the second work function tuning layer 114B isa multi-layer of tungsten-containing PWFMs. Although FIGS. 22A-23B showembodiments where the first work function tuning layer 114A is omitted,it should be appreciated that in other embodiments the first workfunction tuning layer 114A is included. In some embodiments, the secondwork function tuning layer 114B is a bi-layer of tungsten-containingPWFMs, including a first work function tuning sub-layer 114B₁ and asecond work function tuning sub-layer 114B₂ on the first work functiontuning sub-layer 114B₁, as illustrated by FIGS. 22A-22B. In someembodiments, the second work function tuning layer 114B is a tri-layerof tungsten-containing PWFMs, which is similar to a bi-layer but furtherincludes a third work function tuning sub-layer 114B₃ on the second workfunction tuning sub-layer 114B₂, as illustrated by FIGS. 23A-23B. Eachof the sub-layers is a single continuous layer of a differenttungsten-containing PWFM. The tungsten-containing material of the firstwork function tuning sub-layer 114B₁ may (or may not) be the same as thetungsten-containing material of the third work function tuning sub-layer114B₃. In some embodiments, the first work function tuning sub-layer114B₁ is fluorine-free tungsten, the second work function tuningsub-layer 114B₂ is tungsten nitride, and the third work function tuningsub-layer 114B₃ (if present) is fluorine-free tungsten. In someembodiments, the first work function tuning sub-layer 114B₁ is tungstennitride, the second work function tuning sub-layer 114B₂ isfluorine-free tungsten, and the third work function tuning sub-layer114B₃ (if present) is tungsten nitride.

When the second work function tuning layer 114B is a multi-layer oftungsten-containing PWFMs, the sub-layers of tungsten-containing PWFMsare deposited so that the lower sub-layer of the second work functiontuning layer 114B (e.g., the first work function tuning sub-layer 114B₁)merges and seams together. For example, the lower sub-layer of thesecond work function tuning layer 114B may have a greater thickness thaneach of the upper sub-layer(s) of the second work function tuning layer114B (e.g., the third work function tuning sub-layer 114B₃ (if present)and the second work function tuning sub-layer 114B₂), which may avoidmerging of the upper sub-layer(s) and promote merging of the lowersub-layer.

Some embodiments contemplate the use of other tungsten-containing PWFMs.For example, although some of the previously-described embodiments usetungsten nitride for a tungsten-containing PWFM, carbides of tungstenmay also be used. In some embodiments, tungsten carbide and/or tungstencarbonitride may be used in lieu of (or in addition to) tungstennitride.

Embodiments may achieve advantages. Tungsten is suitable for tuning thework function of the devices in the p-type region 50P. Forming thesecond work function tuning layer 114B of a tungsten-containing PWFMallows the threshold voltages of the resulting devices to be tuned.Further, tungsten-containing PWFMs have a low resistivity. Forming thesecond work function tuning layer 114B of a tungsten-containing PWFMallows the gate electrodes 124 in the p-type region 50P to have a lowerresistance than gate electrodes with work function tuning layers formedof a PWFM that contains other metals (such as tantalum). Deviceperformance may thus be improved.

In an embodiment, a device includes: a first nanostructure; a secondnanostructure; a gate dielectric layer wrapped around the firstnanostructure and the second nanostructure; a tungsten-free workfunction tuning layer wrapped around the gate dielectric layer; atungsten-containing work function tuning layer wrapped around thetungsten-free work function tuning layer, an area between the firstnanostructure and the second nanostructure being completely filled byrespective portions of the tungsten-containing work function tuninglayer, the tungsten-free work function tuning layer, and the gatedielectric layer; and a fill layer on the tungsten-containing workfunction tuning layer. In some embodiments of the device, a firstmaterial of the tungsten-containing work function tuning layer has alower resistivity than a second material of the tungsten-free workfunction tuning layer. In some embodiments of the device, thetungsten-containing work function tuning layer includes fluorine-freetungsten. In some embodiments of the device, the tungsten-containingwork function tuning layer includes tungsten nitride, tungsten carbide,or tungsten carbonitride. In some embodiments of the device, thetungsten-containing work function tuning layer is a single continuouslayer of a tungsten-containing material. In some embodiments of thedevice, the tungsten-containing work function tuning layer includes: afirst layer of a first tungsten-containing material wrapped around thetungsten-free work function tuning layer; and a second layer of a secondtungsten-containing material wrapped around the first layer of the firsttungsten-containing material, the second tungsten-containing materialdifferent from the first tungsten-containing material. In someembodiments of the device, the tungsten-containing work function tuninglayer further includes: a third layer of the first tungsten-containingmaterial wrapped around the second layer of the secondtungsten-containing material.

In an embodiment, a device includes: a p-type transistor including: afirst channel region; a first gate dielectric layer on the first channelregion; a tungsten-containing work function tuning layer on the firstgate dielectric layer; and a first fill layer on the tungsten-containingwork function tuning layer; and an n-type transistor including: a secondchannel region; a second gate dielectric layer on the second channelregion; a tungsten-free work function tuning layer on the second gatedielectric layer; and a second fill layer on the tungsten-free workfunction tuning layer. In some embodiments of the device, notungsten-containing layers are disposed between the first channel regionand the tungsten-containing work function tuning layer. In someembodiments of the device, the tungsten-containing work function tuninglayer includes fluorine-free tungsten or tungsten nitride, and thetungsten-free work function tuning layer includes titanium aluminum.

In an embodiment, a method includes: forming a gate dielectric layerhaving a first portion wrapped around a first nanostructure; depositinga first tungsten-free work function material on the first portion of thegate dielectric layer; depositing a tungsten-containing work functionmaterial on the first tungsten-free work function material, thetungsten-containing work function material having a lower resistivitythan the first tungsten-free work function material; and depositing afill layer on the tungsten-containing work function material. In someembodiments of the method, depositing the tungsten-containing workfunction material includes: depositing fluorine-free tungsten by an ALDprocess, the ALD process performed with tungsten(V) chloride andhydrogen, the ALD process performed at a temperature in a range of 300°C. to 500° C., the ALD process performed at a pressure in a range of 0.5torr to 50 torr. In some embodiments of the method, depositing thetungsten-containing work function material includes: depositing tungstennitride by an ALD process, the ALD process performed withbis(tert-butylimino)-bis-(dimethylamido)tungsten and ammonia, the ALDprocess performed at a temperature in a range of 200° C. to 450° C., theALD process performed at a pressure in a range of 0.1 torr to 60 torr.In some embodiments of the method, depositing the tungsten-containingwork function material includes: depositing a single continuous layer ofthe tungsten-containing work function material. In some embodiments ofthe method, depositing the tungsten-containing work function materialincludes: depositing a multi-layer of tungsten-containing work functionmaterials. In some embodiments of the method, the gate dielectric layerhas a second portion wrapped around a second nanostructure, the methodfurther including: depositing a second tungsten-free work functionmaterial on the second portion of the gate dielectric layer, the secondtungsten-free work function material different from the firsttungsten-free work function material; and depositing the fill layer onthe second tungsten-free work function material. In some embodiments,the method further includes: growing p-type source/drain regions on asubstrate, the first nanostructure disposed between the p-typesource/drain regions; and growing n-type source/drain regions on thesubstrate, the second nanostructure disposed between the n-typesource/drain regions. In some embodiments of the method, the secondtungsten-free work function material has a lower resistivity than thefirst tungsten-free work function material and a higher resistivity thanthe tungsten-containing work function material. In some embodiments ofthe method, the first tungsten-free work function material includestitanium nitride, the tungsten-containing work function materialincludes fluorine-free tungsten or tungsten nitride, and the secondtungsten-free work function material includes titanium aluminum. In someembodiments of the method, the first tungsten-free work functionmaterial is deposited to a first thickness, and the tungsten-containingwork function material is deposited to a second thickness, the secondthickness greater than the first thickness.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A device comprising: a first nanostructure; asecond nanostructure; a gate dielectric layer wrapped around the firstnanostructure and the second nanostructure; a tungsten-free workfunction tuning layer wrapped around the gate dielectric layer; atungsten-containing work function tuning layer wrapped around thetungsten-free work function tuning layer, an area between the firstnanostructure and the second nanostructure being completely filled byrespective portions of the tungsten-containing work function tuninglayer, the tungsten-free work function tuning layer, and the gatedielectric layer; and a fill layer on the tungsten-containing workfunction tuning layer.
 2. The device of claim 1, wherein a firstmaterial of the tungsten-containing work function tuning layer has alower resistivity than a second material of the tungsten-free workfunction tuning layer.
 3. The device of claim 1, wherein thetungsten-containing work function tuning layer comprises fluorine-freetungsten.
 4. The device of claim 1, wherein the tungsten-containing workfunction tuning layer comprises tungsten nitride, tungsten carbide, ortungsten carbonitride.
 5. The device of claim 1, wherein thetungsten-containing work function tuning layer is a single continuouslayer of a tungsten-containing material.
 6. The device of claim 1,wherein the tungsten-containing work function tuning layer comprises: afirst layer of a first tungsten-containing material wrapped around thetungsten-free work function tuning layer; and a second layer of a secondtungsten-containing material wrapped around the first layer of the firsttungsten-containing material, the second tungsten-containing materialdifferent from the first tungsten-containing material.
 7. The device ofclaim 6, wherein the tungsten-containing work function tuning layerfurther comprises: a third layer of the first tungsten-containingmaterial wrapped around the second layer of the secondtungsten-containing material.
 8. A device comprising: a p-typetransistor comprising: a first channel region; a first gate dielectriclayer on the first channel region; a tungsten-containing work functiontuning layer on the first gate dielectric layer; and a first fill layeron the tungsten-containing work function tuning layer; and an n-typetransistor comprising: a second channel region; a second gate dielectriclayer on the second channel region; a tungsten-free work function tuninglayer on the second gate dielectric layer; and a second fill layer onthe tungsten-free work function tuning layer.
 9. The device of claim 8,wherein no tungsten-containing layers are disposed between the firstchannel region and the tungsten-containing work function tuning layer.10. The device of claim 8, wherein the tungsten-containing work functiontuning layer comprises fluorine-free tungsten or tungsten nitride, andthe tungsten-free work function tuning layer comprises titaniumaluminum.
 11. A method comprising: forming a gate dielectric layerhaving a first portion wrapped around a first nanostructure; depositinga first tungsten-free work function material on the first portion of thegate dielectric layer; depositing a tungsten-containing work functionmaterial on the first tungsten-free work function material, thetungsten-containing work function material having a lower resistivitythan the first tungsten-free work function material; and depositing afill layer on the tungsten-containing work function material.
 12. Themethod of claim 11, wherein depositing the tungsten-containing workfunction material comprises: depositing fluorine-free tungsten by an ALDprocess, the ALD process performed with tungsten(V) chloride andhydrogen, the ALD process performed at a temperature in a range of 300°C. to 500° C., the ALD process performed at a pressure in a range of 0.5torr to 50 torr.
 13. The method of claim 11, wherein depositing thetungsten-containing work function material comprises: depositingtungsten nitride by an ALD process, the ALD process performed withbis(tert-butylimino)-bis-(dimethylamido)tungsten and ammonia, the ALDprocess performed at a temperature in a range of 200° C. to 450° C., theALD process performed at a pressure in a range of 0.1 torr to 60 torr.14. The method of claim 11, wherein depositing the tungsten-containingwork function material comprises: depositing a single continuous layerof the tungsten-containing work function material.
 15. The method ofclaim 11, wherein depositing the tungsten-containing work functionmaterial comprises: depositing a multi-layer of tungsten-containing workfunction materials.
 16. The method of claim 11, wherein the gatedielectric layer has a second portion wrapped around a secondnanostructure, the method further comprising: depositing a secondtungsten-free work function material on the second portion of the gatedielectric layer, the second tungsten-free work function materialdifferent from the first tungsten-free work function material; anddepositing the fill layer on the second tungsten-free work functionmaterial.
 17. The method of claim 16 further comprising: growing p-typesource/drain regions on a substrate, the first nanostructure disposedbetween the p-type source/drain regions; and growing n-type source/drainregions on the substrate, the second nanostructure disposed between then-type source/drain regions.
 18. The method of claim 16, wherein thesecond tungsten-free work function material has a lower resistivity thanthe first tungsten-free work function material and a higher resistivitythan the tungsten-containing work function material.
 19. The method ofclaim 16, wherein the first tungsten-free work function materialcomprises titanium nitride, the tungsten-containing work functionmaterial comprises fluorine-free tungsten or tungsten nitride, and thesecond tungsten-free work function material comprises titanium aluminum.20. The method of claim 11, wherein the first tungsten-free workfunction material is deposited to a first thickness, and thetungsten-containing work function material is deposited to a secondthickness, the second thickness greater than the first thickness.